Optoeletronics group: Principal Engineer Position in Optoelectronic Packaging

ICFO is coordinating the European Chips JU Pilot Line PIXEurope on Advanced Photonic Integrated Circuits (PICs) as well as the Catalan PhotonChip project. As part of our expanding efforts, we are reinforcing our leadership in the full PIC value chain—including design, fabrication, advanced packaging, testing, and application development.

We are seeking an experienced scientist or engineer with a strong background in PIC packaging and testing, particularly in industry-driven environments. The selected candidate will play a key role in shaping ICFO’s strategy in this domain, contributing to leading-edge R&D and fostering technology transfer.

Key Responsibilities:

The successful candidate will be expected to:

- Provide hands-on technical expertise in packaging and testing of PICs, ensuring high-quality deliverables aligned with industrial standards.
- Train, supervise, and coordinate the work of technicians and junior engineers within the group.
- Lead the procurement, installation, and operational management of specialized equipment and infrastructure.
- Drive application-specific R&D&E projects, particularly those developed in close collaboration with industrial partners and end-users

You will be joining the Optoelectronics group led by Prof. Dr. Valerio Pruneri, renowned for cutting-edge work in advanced materials and photonic systems for next-generation communication, imaging, and cybersecurity technologies. The group’s mission is to bridge the gap between academic research and industrial innovation by translating disruptive ideas into real-world photonic products.

Aquest contracte està cofinançat amb el Fons Europeu de Desenvolupament Regional (FEDER) de la Unió Europea, en el marc del Programa del FEDER de Catalunya 2021- 2027”.